【For electronic devices】φ0.02 drilling Hotobell (ceramics)
Solving the heat dissipation problem of electronic devices! Improved performance through micro-hole processing.
In the electronics industry, as miniaturization and high performance progress, heat dissipation measures have become an important issue. In particular, electronic components with high-density mounting face an increased risk of performance degradation and failure due to heat generation. To achieve effective heat dissipation, the use of materials with high thermal conductivity and the establishment of heat dissipation pathways are essential. Our φ0.02 drilling technology contributes to improved heat dissipation performance by creating fine holes in machinable ceramics such as Hotavel. 【Usage Scenarios】 - High-density mounted electronic devices - Semiconductor devices - Heat dissipation substrates 【Benefits of Implementation】 - Improved heat dissipation efficiency - Increased product lifespan - Stabilization of performance
- 企業：SANWA CREATION Co.,Ltd.
- 価格：Other
